Equipment
Engineering/ Inner Layer/ Lamination
Equipment-Outer Layer
Equipment-Outer Layer
PCB Manufacturing capabilities
- Rigid, Flex, Rigid-Flex, Metal Core, HDI, High-Frequency, High-TG
- Max Number of PCB Layers: Up to 48 Layers
- Max Circuit Board Size: 23.62″x 39.37″ (599.95 mm x 1000 mm)
- Min Trace/Space: 2 mil (0.05mm)
- Core Material: ≥2mil（0.05mm）
- Min Laser Drill Size: 3 mil (0.0762mm)
- Max Inner/Outer Copper: 5oz / 11 oz
- Controlled Impedance +/-7%
- Hole Size Tolerance: NPTH:±2mils(±0.05mm) PTH:±3mils(±0.075mm)
- Blind / Buried Vias
- Min. Dielectric Thickness : 2mil(0.05mm)
- Material: FR4, FR4 High Tg, Aluminum, Rogers, Arlon, etc.
- Surface: Lead Solder (HASL), Lead Free Solder(HASL – LF), ENIG, Immersion Silver, Immersion Tin, OSP, Hard Gold, Flash Gold, etc.
- RoHS Compliant
- Class II & Class III
- UL certified
- ISO 9001
- Panelization
- Stencil Design
Equipment-Surface Finish
Equipment-Q.A Reliability
Equipment-Outer Layer
Equipment-Q.A Reliability
Contact us
Kunshan SNC Circuit Tech Co Ltd.,
Contact：sales@sncpcb.com
Address: Building C, #268 Jiguangnan Road, Kunshan City, Jiangsu Provence, China.
Tel: +86 13773174476 (Whatsapp) /Miss Mika